Rotating device for silicon wafer etching machine

The utility model discloses a rotating device for a silicon wafer etching machine, which comprises a bottom plate, guide structures are fixedly mounted on two sides of the top end of the bottom plate, a bearing platform is fixedly mounted on one sides, far away from the bottom plate, of the two guide structures, a plurality of grooves are formed in the top end of the bearing platform in a rectangular array manner, and the grooves are communicated with the bottom plate. A plurality of grooves are formed in the bottom plate, wafer box bodies are fixedly mounted in the grooves, a plurality of rotating assemblies are fixedly mounted on the two sides of the top end of the bottom plate at equal intervals, the rotating assemblies are fixedly connected to one side of the bearing platform, each rotating assembly comprises a mounting base fixedly mounted on one side of the top of the bottom plate, and a motor is fixedly mounted in each mounting base; and a rotating disc is fixedly mounted on a motor shaft of the motor.