Semiconductor wafer cleaning clamp

The utility model discloses a semiconductor wafer cleaning clamp, and relates to the technical field of semiconductor processing, and the semiconductor wafer cleaning clamp comprises a connecting plate and a clamping module; a first connecting structure is arranged at one end of one side surface of the connecting plate; a second connecting structure is arranged at the other end of one side surface of the connecting plate; the clamping module comprises a module body and two wafer clamping jaws; the module body is provided with a third connecting structure which is detachably connected and matched with the second connecting structure; the module body is provided with two movable parts which can be opened or closed in a matched mode. The two wafer clamping jaws are detachably connected to the two movable parts in a one-to-one correspondence mode. The robot and the wafer are connected in series, it is guaranteed that the robot clamps, cleans and carries the wafer stably and repeatedly, and the problem that the st