Vapor chamber and heat dissipation assembly
The utility model discloses a vapor chamber and a heat dissipation assembly, the vapor chamber is arranged between a heat source and a heat dissipation mechanism, and the vapor chamber comprises a lower cover plate and an upper cover plate. The lower portion of the lower cover plate abuts against th...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a vapor chamber and a heat dissipation assembly, the vapor chamber is arranged between a heat source and a heat dissipation mechanism, and the vapor chamber comprises a lower cover plate and an upper cover plate. The lower portion of the lower cover plate abuts against the heat source. The upper cover plate covers the lower cover plate, the upper cover plate and the lower cover plate are sealed to form a vacuum phase change heat exchange chamber, and a plurality of assembling grooves are formed in the upper surface of the upper cover plate. The bottom of the heat dissipation mechanism can be detachably fixed in the multiple assembly grooves. Therefore, the vapor chamber disclosed by the utility model is simple and reasonable in structure, the contact thermal resistance is reduced, and the heat exchange capability is greatly improved.
本实用新型公开了一种均热板及散热组件,其中均热板设置在热源与散热机构之间,且均热板包括:下盖板以及上盖板。下盖板的下方与热源相抵接。以及上盖板盖设于下盖板的上方,并与下盖板密封形成真空相变换热腔室,且上盖板的上表面开设有多个组装槽。其中,散热机构的底部能够拆卸地固定于多个组装槽内。借此,本实用新型的 |
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