Multilayer anti-oxidation printed circuit board

The utility model relates to the technical field of circuit board production, in particular to a multilayer anti-oxidation printed circuit board, which comprises an inner-layer metal substrate, and a first insulating layer and a second insulating layer are respectively adhered to the top surface and the bottom surface of the inner-layer metal substrate. The top surface of the first insulating layer and the bottom surface of the second insulating layer are respectively bonded with a top surface metal substrate and a bottom surface metal substrate; through the arrangement of the anti-oxidation layer, the outer surfaces of the top surface metal substrate and the bottom surface metal substrate are not liable to be corroded by air, and the service life of the circuit board is prolonged while the use quality of the circuit board is ensured; through the arrangement of the conductive through holes and the conductive layer, compared with a conductor with the same size, the conductive layer can effectively improve the