Substrate structure of power module

The utility model provides a substrate structure of a power module, which relates to the technical field of power modules and comprises a bottom plate provided with a conductive copper layer. The conductive copper layer is divided into a first connection area, a second connection area, a first arrangement area and a second arrangement area through grooves. The first arrangement area and the second arrangement area are located between the first connection area and the second connection area; a plurality of first power chips are arranged in the first arrangement area and the second arrangement area so as to communicate the first connection area with the second connection area; the second arrangement area is also provided with a second power chip with a temperature sensor and a current sensor; a sensor terminal and an aluminum wire welding point area are arranged between the second power chip and the first power chip adjacent to the second power chip, so that a gate-level circuit contact on the second power chip