Cutting equipment

The cutting equipment is provided with a first path used for semiconductor element circulation. The first path is provided with a material receiving station, a waste material station, a material supply station, an adjusting station and a cutting station. A positioning visual module, a reinspection visual module and a carrying module are arranged above the first path; the cutting station is provided with a cutting platform and an adsorption module installed on the cutting platform, and the cutting platform is provided with a discharging hole and can move in a reciprocating mode in the first direction. The adsorption module is arranged at the edge of the blanking hole in a surrounding manner; the adsorption module comprises a fixed seat and a movable seat which are opposite in the second direction and are arranged at an interval, and a material removing space communicating with the blanking hole is formed between the fixed seat and the movable seat; the movable base can move close to or away from the fixed base