Semiconductor wafer processing scribing machine with rapid positioning function

The utility model discloses a semiconductor wafer processing scribing machine with a rapid positioning function, which comprises a workbench, two positioning mechanisms, an adsorption mechanism, a scribing mechanism and a control panel, and is characterized in that the two positioning mechanisms are...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ZHANG KEQIN, WANG ZANYU, BAI WENLING, WANG BO, JIA HAO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses a semiconductor wafer processing scribing machine with a rapid positioning function, which comprises a workbench, two positioning mechanisms, an adsorption mechanism, a scribing mechanism and a control panel, and is characterized in that the two positioning mechanisms are respectively arranged on two sides of the top of the workbench; the positioning mechanism is composed of servo electric cylinders and arc-shaped clamping plates, bearing plates are fixedly connected to the two sides of the workbench, and the two servo electric cylinders are installed at the tops of the two bearing plates correspondingly. According to the utility model, the two positioning mechanisms are arranged on the workbench, the two arc-shaped clamping plates on the two positioning mechanisms are used for pushing the wafer to move, and infrared rays are used for real-time distance measurement, so that the wafer can quickly move to a specified position, and the distance between the two arc-shaped clamping plat