Semiconductor welding part turnover jig
The utility model provides a semiconductor welding part turnover jig which comprises a transfer support and a partition plate arranged on the transfer support, and the transfer support comprises a connecting plate and baffles arranged on the two sides of the connecting plate in parallel. Mounting gr...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The utility model provides a semiconductor welding part turnover jig which comprises a transfer support and a partition plate arranged on the transfer support, and the transfer support comprises a connecting plate and baffles arranged on the two sides of the connecting plate in parallel. Mounting grooves are symmetrically formed in the two sides of the baffle and used for containing the partition plate, the mounting grooves are distributed at equal intervals in the height direction of the baffle, and when the partition plate is arranged in the mounting grooves, the side, away from the connecting plate, of the partition plate extends outwards to form a blocking edge perpendicular to the partition plate; the partition plate and the transfer support are enclosed to form a containing space used for containing welding parts. According to the utility model, the problem that chips are scrapped due to the fact that the chips are damaged when the semiconductor welding parts are transferred is solved.
本实用新型提供一种半导体焊接件周转 |
---|