Silicon wafer degumming device for semiconductor processing
The utility model discloses a silicon wafer degumming device for semiconductor processing, which comprises a box body, the box body is provided with a heating device and a placing frame, the placing frame comprises two lifting plates which are oppositely arranged, the lifting plates are arranged in...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a silicon wafer degumming device for semiconductor processing, which comprises a box body, the box body is provided with a heating device and a placing frame, the placing frame comprises two lifting plates which are oppositely arranged, the lifting plates are arranged in a sliding manner along the vertical direction of the box body, a plurality of placing plates are arranged on the opposite side surfaces of the lifting plates in a staggered manner, and the placing plates are arranged on the box body. Baffles are arranged at the two ends of the containing plate, grooves are formed in the opposite sides of the baffles, the degumming device comprises a lifting control mechanism, the lifting control mechanism comprises a connecting plate arranged at the end of a lifting plate, and a telescopic rod is hinged to the side face of the connecting plate. The two telescopic rods are connected to rotating shafts respectively and located in different radial directions, and the rotating shafts a |
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