Transient suppression diode of novel molybdenum sheet packaging structure

The utility model discloses a transient suppression diode with a novel molybdenum sheet packaging structure. A tube core structure of the transient suppression diode sequentially comprises a heat dissipation block, a first soldering lug parallel connection lead, a first protection substrate, a chip,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YANG MINHONG, LIU YUNJI, ZHANG CHAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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