Transient suppression diode of novel molybdenum sheet packaging structure

The utility model discloses a transient suppression diode with a novel molybdenum sheet packaging structure. A tube core structure of the transient suppression diode sequentially comprises a heat dissipation block, a first soldering lug parallel connection lead, a first protection substrate, a chip, a second protection substrate and a bottom plate connection soldering lug II from top to bottom, the packaging body packages and wraps the transient voltage suppressor tube core structure; the area of the bottom plate is larger than those of the first and second protection bases and the chip; the epoxy wraps the bottom plate and exposes the bottom surface, and the thickness of the packaging body at the periphery of the bottom plate is 0.3-4mm; the first protection substrate and the second protection substrate use nickel-plated molybdenum sheets without plating layers on the side edges as the protection substrates. 本实用新型公开了一种新型钼片封装结构的瞬态抑制二极管，瞬态抑制二极管管芯结构从上至下依次为包括散热块、焊片一并接引线、第一保护基片、芯片、第二保护基片、底板连接焊片二；封装体封装包裹瞬态抑制二极管管芯结