Transfer device for electronic chip processing

According to the technical scheme, the transfer device for electronic chip processing comprises a bottom plate and a shell, universal wheels are fixedly installed at the four corners of the bottom of the bottom plate, rotating doors are rotationally connected to the left side and the right side of the front face of the shell, two symmetrical openings are formed in the left face and the right face of the shell, and the rotating doors are arranged in the openings. A buffer device is installed between the bottom plate and the outer shell and used for buffering external force borne by the bottom plate and the outer shell, the inner wall of the outer shell is connected with a supporting device, and the supporting device is used for supporting more electronic chips to carry out transportation work. And the chip stacking can be prevented, and meanwhile, a large number of chips can be quickly transferred. 本实用新型公开了一种电子芯片加工用转运装置，其技术方案是：包括底板与外壳，所述底板底部四个拐角处都固定安装有万向轮，所述外壳正面左右两侧都转动连接有转动门，所述外壳左右两面都开设有两个对称的开口，所述底板与外壳之间安装有缓冲装