Semiconductor wafer cutting equipment capable of reducing cutting stress

The utility model discloses semiconductor wafer cutting equipment capable of reducing cutting stress, which comprises a box body, a power distribution control box is arranged at the front end of the box body, a plurality of groups of supporting legs are fixedly arranged at the bottom of the box body, the supporting legs are positioned at four corners of the bottom of the box body, a plurality of groups of fixing pipes are fixedly arranged in the box body, and the fixing pipes are fixedly arranged in the box body. One end of the fixing pipe is fixedly connected with the inner wall of the box body, the other end of the fixing pipe is located in the middle of the box body, the fixing pipe is parallel to the bottom face of the box body, connecting blocks are fixedly installed at the two ends in the fixing pipe, a heating pipe is connected between the connecting blocks in a threaded mode, and a fixing assembly and a cutting assembly are fixedly installed on the inner wall of the upper end of the box body. The fixi