Mounting structure and electronic equipment

The utility model discloses an installation structure and an electronic device, and the installation structure comprises a circuit board support frame and a bonding layer. A to-be-cooled device is arranged on one side of the circuit board, and the side, away from the circuit board, of the to-be-cool...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: SHI YONGLE
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses an installation structure and an electronic device, and the installation structure comprises a circuit board support frame and a bonding layer. A to-be-cooled device is arranged on one side of the circuit board, and the side, away from the circuit board, of the to-be-cooled device is bonded with one side of the radiator; the circuit board is provided with at least one mounting part; one side of the support frame is provided with at least one connecting part, and the connecting part is detachably connected with the mounting part; the other side of the supporting frame is used for abutting against one side of the radiator, and the to-be-radiated device and the supporting frame abut against the same side of the radiator. The bonding layer is arranged on the side, away from the circuit board, of the to-be-cooled device, and the side, away from the to-be-cooled device, of the bonding layer is used for being bonded with one side of the radiator. According to the technical scheme, the to-