Laser etching equipment

A laser etching apparatus is provided. The laser etching apparatus includes: a laser etching chamber; the chuck is arranged in the laser etching chamber; the laser module emits a laser beam towards the chuck; a protection window assembly between the chuck and the laser module; a position sensor conf...

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Bibliographische Detailangaben
Hauptverfasser: CHOI JUNG-WOO, NA HEUNG-YEOL, YEON SEONG-JIN, KIM YOONOL
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:A laser etching apparatus is provided. The laser etching apparatus includes: a laser etching chamber; the chuck is arranged in the laser etching chamber; the laser module emits a laser beam towards the chuck; a protection window assembly between the chuck and the laser module; a position sensor configured to sense a position of the protection window assembly; and a linear motion unit configured to move the protection window assembly. The present invention relates to a laser etching apparatus capable of increasing a replacement period of a protection window by depositing particles generated from a substrate during a process of forming a hole on the protection window. 提供了一种激光蚀刻设备。所述激光蚀刻设备包括:激光蚀刻室;卡盘,设置在激光蚀刻室中;激光模块,朝向卡盘发射激光束;保护窗组件,在卡盘与激光模块之间;位置传感器,被构造为感测保护窗组件的位置;以及线性运动单元,被构造为移动保护窗组件。在形成孔的工艺期间从基底产生的颗粒堆积在保护窗上,所述激光蚀刻设备能够增加保护窗的替换周期。