Wafer conduction sheet assembly and integrated circuit structure

The utility model provides a wafer conduction sheet assembly and an integrated circuit structure. The wafer conduction sheet assembly comprises a first conduction sheet and a second conduction sheet. The first conduction sheet comprises a first electrode connecting part and a plurality of first signal transmission parts. Two opposite surfaces of the first electrode connecting part are respectively provided with a first protruding area, a first recessed area, a second protruding area and a second recessed area. The first protruding area is used for contacting the first electrode, and the second protruding area is used for contacting the first expansion electrode. And the second conduction sheet is electrically isolated from the first conduction sheet, the second conduction sheet comprises a second electrode connecting part and a second signal transmission part, two opposite surfaces of the second electrode connecting part are respectively provided with a third protruding area and a third concave area, and the