Transfer mechanism of semiconductor wafer

According to the semiconductor wafer transfer mechanism provided by the utility model, at least one material platform and the transverse manipulator structure form a structure for clamping the semiconductor wafer, and the structure is specially used for clamping the semiconductor wafer to improve th...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SHA WEIZHONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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