Transfer mechanism of semiconductor wafer

According to the semiconductor wafer transfer mechanism provided by the utility model, at least one material platform and the transverse manipulator structure form a structure for clamping the semiconductor wafer, and the structure is specially used for clamping the semiconductor wafer to improve th...

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1. Verfasser: SHA WEIZHONG
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:According to the semiconductor wafer transfer mechanism provided by the utility model, at least one material platform and the transverse manipulator structure form a structure for clamping the semiconductor wafer, and the structure is specially used for clamping the semiconductor wafer to improve the clamping efficiency. Specifically, a wafer box for storing wafers is positioned on a material platform, and a transverse manipulator moves to the position of the wafer box. The mechanical arm structure is composed of a transverse moving mechanism, a rotating mechanism, a lifting mechanism and a clamping jaw device arranged on the rotating mechanism. Wherein the transverse moving mechanism and the lifting mechanism control the mechanical arm to move in the horizontal direction and the vertical direction, the rotating mechanism drives the clamping jaw device to point to the position of a wafer box after the mechanical arm reaches a designated position, and a moving bottom plate of the clamping jaw device moves forw