Temperature control and heat dissipation system for chip test
The utility model discloses a temperature control and heat dissipation system for chip testing. The temperature control and heat dissipation system for chip testing comprises a dielectric layer, a semiconductor chilling plate and a heat dissipation piece. The dielectric layer comprises a first diele...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model discloses a temperature control and heat dissipation system for chip testing. The temperature control and heat dissipation system for chip testing comprises a dielectric layer, a semiconductor chilling plate and a heat dissipation piece. The dielectric layer comprises a first dielectric layer and a second dielectric layer; one end of the semiconductor chilling plate is connected with the test board through the first dielectric layer, and the other end is connected with the heat dissipation piece through the second dielectric layer; the test board is connected with a plurality of control boards, a heat dissipation piece is arranged between every two adjacent control boards, one end of each heat dissipation piece is connected with the second dielectric layer, the other end of each heat dissipation piece is provided with a flow guide plate, the two ends of each flow guide plate abut against the two control boards respectively to form air cooling gaps, ventilation holes are formed in the heat di |
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