Flip packaging structure of power supply type product QFN (Quad Flat No-lead)

The utility model discloses a power supply product QFN flip-chip packaging structure, which relates to the technical field of QFN flip-chip packaging structures and comprises a frame, conductive discs are arranged at the lower end of the frame and distributed in an array shape, a cover plate is arranged at the upper end of the frame, and a connecting mechanism is arranged at the upper end of the frame. According to the utility model, the problems that when an existing flip packaging structure of the QFN is used, the frame and the cover are mostly connected in a bonding mode, the bonding is easily influenced by high temperature, the joint of the cover and the frame is cracked, the QFN packaging structure is damaged, and the service life is shortened are solved; through the arrangement of the conductive disc, the support, the rubber block, the heat conduction strip, the heat dissipation plate, a connecting mechanism, a fixing block, a long strip, a groove, a long groove and a clamping block, the cover plate and