Surface-mounted three-dimensional assembled optical isolation circuit shell

The utility model discloses a surface-mounted three-dimensional assembled optical isolation circuit shell, which comprises a shell base part and a cover plate part, the shell base part comprises a plurality of layers of ceramic substrates on which gold conduction bands are arranged, quadrilateral ce...

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1. Verfasser: SHANG AIYING
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The utility model discloses a surface-mounted three-dimensional assembled optical isolation circuit shell, which comprises a shell base part and a cover plate part, the shell base part comprises a plurality of layers of ceramic substrates on which gold conduction bands are arranged, quadrilateral ceramic cavity side walls integrated with the ceramic substrates are arranged around the ceramic substrates, and the gold conduction bands are arranged at the tops of the cavity side walls; gold conduction bands in mirror symmetry are arranged on the front face and the back face of the cover plate part, and the gold conduction bands on the corresponding portions of the front face and the back face are connected through metalized through holes or side face metallization. And the cover plate ceramic substrate, the metalized through holes and the gold conduction bands on the front surface and the back surface adopt a co-firing process. The integrated circuit packaging structure is completely compatible with a normal int