Take-out box achieving refrigeration through semiconductor chilling plate

The take-out box comprises a box body and a box cover, an installation hole communicated with an inner cavity of the box body is formed in the outer side wall of the box body, a heat insulation plate is fixedly arranged at the position, located at a hole opening of the outer side wall of the box bod...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	DENG FANGWEI, GONG ZHIWEI, TAO JUNHUI, GUAN QINGLU, LI JIE, CHEN XINQI, TAO JINPING, LUO HUI, WANG CHUANHUI, ZHU MUGUANG, QI HONGYAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR BLASTING COMBINED HEATING AND REFRIGERATION SYSTEMS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING STORING TRANSPORTING WEAPONS
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Beschreibung
Zusammenfassung:	The take-out box comprises a box body and a box cover, an installation hole communicated with an inner cavity of the box body is formed in the outer side wall of the box body, a heat insulation plate is fixedly arranged at the position, located at a hole opening of the outer side wall of the box body, of the installation hole, and one end of the heat insulation plate is fixedly connected with the outer side wall of the box body. An external cooling fin is fixedly arranged at the other end of the heat insulation plate, a semiconductor chilling plate is embedded in the heat insulation plate, an internal cooling fin fixedly connected with the heat insulation plate is arranged in the installation hole, the cold end of the semiconductor chilling plate abuts against the internal cooling fin, and the hot end of the semiconductor chilling plate abuts against the external cooling fin. A cold-end fan is fixedly arranged on the internal radiating fin, and a hot-end fan is fixedly arranged on the external radiating fin;