Low-light-attenuation assembled semiconductor light-emitting element

The utility model provides a low luminous decay assembled semiconductor light-emitting element, which comprises a semiconductor light-emitting body and a packaging structure, the semiconductor light-emitting body is arranged in the packaging structure, and a plurality of heat conduction blocks are fixedly arranged on the peripheral side of the packaging structure in a penetrating manner. The semiconductor light-emitting element adopts an assembled structure of the semiconductor light-emitting body and the packaging structure, the heat dissipation effect is good, heat generated by the semiconductor light-emitting body can be effectively dissipated, the light-emitting efficiency of the semiconductor light-emitting element is ensured, and the service life of the semiconductor light-emitting element is greatly prolonged. 本实用新型提供一种低光衰组装式半导体发光元件，包括半导体发光本体及封装结构，半导体发光本体安装于所述封装结构内，封装结构的周侧贯穿固定设有若干导热块。本实用新型中的半导体发光元件采用半导体发光本体及封装结构的组装式结构，散热效果佳，半导体发光本体产生的热量可有效的散发，确保了半导体发光元件的发光效率，大大的延长了半导体发光元件的使用寿命。