Lateral light-emitting flip-chip LED packaging structure
The utility model discloses a side light emitting flip LED packaging structure which comprises a packaging support and a plurality of split fixing supports, the packaging support is provided with a plurality of fixing grooves at intervals, the fixing supports and the packaging support are integrally...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a side light emitting flip LED packaging structure which comprises a packaging support and a plurality of split fixing supports, the packaging support is provided with a plurality of fixing grooves at intervals, the fixing supports and the packaging support are integrally assembled through the fixing grooves, plane electrodes are arranged on the fixing supports, and LED chips arranged at intervals are welded on two adjacent plane electrodes. The side light-emitting flip LED packaging structure has the advantages of being high in welding reliability, compact in structure and low in cost.
本实用新型公开了一种侧发光倒装LED封装结构,包括封装支架和若干分体的固定支架,封装支架间隔设有若干固定槽,固定支架通过固定槽与封装支架进行一体式装配,固定支架上设有平面电极,间隔设置的LED芯片焊接于两相邻的平面电极上。本实用新型的侧发光倒装LED封装结构具有焊接可靠性高、结构紧凑和成本低廉的特点。 |
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