High-thermal-conductivity LED packaging illumination circuit board

The utility model relates to the technical field of LED packaging lighting circuit boards, in particular to a high-thermal-conductivity LED packaging lighting circuit board which comprises a shell and a PCB, the PCB is connected to the inner side surface of the shell in a clamped mode, an installati...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CAO ZHICHAO, CHEN GANGAN, DU MINZHI, MA HUOSHENG, DING JIANHUA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MECHANICAL ENGINEERING STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The utility model relates to the technical field of LED packaging lighting circuit boards, in particular to a high-thermal-conductivity LED packaging lighting circuit board which comprises a shell and a PCB, the PCB is connected to the inner side surface of the shell in a clamped mode, an installation column is fixedly connected to the upper surface of the PCB, an installation groove used for installing an LED lamp, a heat conduction device and a heat dissipation device are arranged on the upper surface of the installation column, and the heat conduction device comprises a heat dissipation device body and a heat dissipation device body. The copper column penetrates through the PCB and is fixedly connected to the lower surface of the mounting column, the lower surface of the copper column is fixedly connected with a heat dissipation plate and a copper pipe, the copper pipe penetrates through the heat dissipation plate and is fixedly connected to the lower surface of the heat dissipation plate, and the heat dis