Cooling and heat dissipation device of ship electric cabinet

The utility model discloses a cooling and radiating device of a ship electric cabinet. The cooling and radiating device comprises a heat absorption radiator, a heat conduction block, a connecting plate, a semiconductor chilling plate, a heat release radiator and a cold end housing, the heat-conducti...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WEI YAOQI, XING XIAOJUN, MA JIXIAN, WANG CHANGBAO, LING YOULIN, JING GUOLIANG, JI XINGGUO, JIANG ZHENGYANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMBINED HEATING AND REFRIGERATION SYSTEMS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES HEAT PUMP SYSTEMS HEATING INKS LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING USE OF MATERIALS THEREFOR WEAPONS WOODSTAINS
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Beschreibung
Zusammenfassung:	The utility model discloses a cooling and radiating device of a ship electric cabinet. The cooling and radiating device comprises a heat absorption radiator, a heat conduction block, a connecting plate, a semiconductor chilling plate, a heat release radiator and a cold end housing, the heat-conducting block is fixedly connected to the upper part of the heat-absorbing radiator; a refrigeration sheet hole is formed in the middle of the connecting plate, the heat absorption radiator is fixedly connected to the lower portion of the connecting plate, and the heat conduction block is embedded into the refrigeration sheet hole; the semiconductor chilling plate is embedded in the upper portion of the chilling plate hole of the connecting plate, the cold end of the semiconductor chilling plate is downwards attached to the heat conduction block, the hot end of the semiconductor chilling plate is upwards attached to the heat release radiator, and the heat release radiator is connected to the connecting plate. The cold e