Ceramic packaging structure and acceleration sensor

The utility model provides a ceramic packaging structure and an acceleration sensor, and the packaging structure comprises a first ceramic substrate which is used for installing an external element; the second ceramic substrate is arranged between the first ceramic substrate and the third ceramic substrate; and the third ceramic substrate is also connected with an external power supply. By arranging the first ceramic substrate, the second ceramic substrate and the third ceramic substrate, the ceramic substrates are directly used as a packaging shell, and substrate installation is not needed, so that the space is greatly saved, the packaging can be smaller, and the packaging efficiency is improved. The requirements of high integration level and complexity can be met, and meanwhile, the circuit is small in size, low in power consumption, low in parasitic impedance and high in anti-interference performance; the ceramic substrate has good heat dissipation performance, and can still work normally in a severe envir