CSP2520 substrate based on surface acoustic wave filter

The utility model discloses a CSP2520 substrate based on a surface acoustic wave filter, and relates to the technical field of surface acoustic wave device packaging, in particular to the CSP2520 substrate based on the surface acoustic wave filter. Comprising a top plate and a bottom plate; the top plate is provided with four independent top layer bonding pads, namely a first top layer bonding pad, a second top layer bonding pad, a third top layer bonding pad and a fourth top layer bonding pad; four independent bottom-layer bonding pads are arranged on the bottom plate and are respectively a first bottom-layer bonding pad, a second bottom-layer bonding pad, a third bottom-layer bonding pad and a fourth bottom-layer bonding pad, the first bottom-layer bonding pad and the second bottom-layer bonding pad are arranged on the same side and correspond to a bonding pad B and a bonding pad E in SMD3030 packaging, and the first bottom-layer bonding pad and the second bottom-layer bonding pad are arranged on the same s