Black glue feeding device of semiconductor automatic packaging system

The utility model discloses a black adhesive feeding device of a semiconductor automatic packaging system, which comprises a stock bin, a direct vibration feeding mechanism, a round vibration, a direct vibration discharging mechanism, a material lifting and jacking mechanism and a black adhesive fee...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XIAO JIANGUO, LI XINGYANG, TIAN JIEFENG, CHEN WENBIAO, MA XIANG, LI DANFENG, MA FEIBIAO, RAO ZHIPENG, WANG BIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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