Black glue feeding device of semiconductor automatic packaging system

The utility model discloses a black adhesive feeding device of a semiconductor automatic packaging system, which comprises a stock bin, a direct vibration feeding mechanism, a round vibration, a direct vibration discharging mechanism, a material lifting and jacking mechanism and a black adhesive feeding controller, the material lifting and jacking mechanism comprises a material lifting module and a jacking module, the material lifting module is provided with a black adhesive positioning groove for realizing vertical placement of black adhesive, and the jacking module is provided with a material lifting module and a jacking module. The device is characterized in that a black glue grabbing mechanical arm is movably arranged between the outlet end of the direct vibration discharging mechanism and the material lifting and jacking mechanism, and the black glue grabbing mechanical arm grabs black glue from the outlet end of the direct vibration discharging mechanism and vertically places the grabbed black glue into