Microwave wafer double-sided polishing equipment

The utility model relates to the technical field of gallium arsenide wafer production, in particular to microwave wafer double-face polishing equipment which comprises a base, a polishing pad is arranged in the base, a top cover is arranged above the outer side of the base, a fixing column is arranged in the top cover, a fixing plate is fixedly connected to the lower portion of the outer side of the fixing column, a screw is spirally connected to the interior of the fixing plate, and the polishing pad is arranged on the base. The screw is arranged in the top cover, the bottom of the fixing column is fixedly connected with a rotating device, the bottom of the rotating device is fixedly connected with first grinding devices which are evenly distributed, the inner top of the top cover is fixedly connected with positioning rods which are evenly distributed, and the bottom of the fixing ring is fixedly connected with connecting rods which are evenly distributed. Through the arrangement of the base, the top cover,