Rapid heat dissipation structure for integrated circuit board

The utility model discloses a quick heat dissipation structure for an integrated circuit board, which comprises a circuit board and a fixed plate, a plurality of heat dissipation fins are uniformly distributed at the bottom of the circuit board, a plurality of slots matched with the heat dissipation fins are arranged on the upper end face of the fixed plate, heat dissipation through holes are arranged on the fixed plate, and the heat dissipation through holes are communicated with the slots. A fan is arranged in the heat dissipation through hole, and a positioning mechanism is arranged between the circuit board and the fixing plate. The circuit board, the fixing plate, the heat dissipation fins, the insertion grooves, the strip-shaped protrusions, the limiting holes, the limiting grooves, the limiting rods, the transmission plate, the transmission rods, the driving columns, the rotary knobs, the limiting bases, the threaded grooves, the heat dissipation through holes and the fan structures are arranged, and c