Packaging structure of power semiconductor module

The utility model belongs to the technical field of power semiconductor devices, and particularly discloses a packaging structure and a packaging method of a power semiconductor module. The packaging structure comprises: a copper-clad ceramic substrate; the power semiconductor chip, the thermistor a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DUAN SANDING, LIU XINMIN, HUANG ZHIZHAO, LI YUXIONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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