Rapid alignment device of ball grid array (BGA) ball mounter

The utility model is suitable for the technical field of semiconductor packaging equipment. The utility model discloses a BGA ball mounter rapid alignment device which comprises a ball taking mechanism and a ball distributing mechanism arranged under the ball taking mechanism, an alignment jig enabl...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YE CHANGLONG, DAI YIYI, DU HAIQUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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