Rapid alignment device of ball grid array (BGA) ball mounter

The utility model is suitable for the technical field of semiconductor packaging equipment. The utility model discloses a BGA ball mounter rapid alignment device which comprises a ball taking mechanism and a ball distributing mechanism arranged under the ball taking mechanism, an alignment jig enabling the ball taking mechanism and the ball distributing mechanism to be rapidly aligned on the same perpendicularity is arranged between the ball taking mechanism and the ball distributing mechanism, and alignment structures are arranged on the upper face and the lower face of the alignment jig respectively. During use, after the alignment structure on the lower surface of the alignment jig is aligned with the ball distribution mechanism, the ball taking mechanism is aligned with the alignment structure on the upper surface of the alignment jig, and the positions of the alignment structures on the upper surface and the lower surface of the alignment jig are relatively stable, so that the ball taking mechanism can b