Thermal printing head with heat dissipation function

The utility model relates to the technical field of thermal printers, in particular to a thermal printing head with a heat dissipation function, which comprises a device shell, a ceramic substrate is fixedly arranged in the device shell, a printed circuit board is fixedly arranged above the ceramic substrate, one side of the ceramic substrate is fixedly connected with a heat dissipation plate, and the other side of the ceramic substrate is fixedly connected with the heat dissipation plate. A first heat conduction pipe is fixedly installed on one side of the heat dissipation plate, and a second heat conduction pipe is fixedly installed on one side of the heat dissipation plate. By arranging the heat dissipation plate, when the device is used, the device shell is firstly installed in the thermal printer, then heat generated during printing is conducted into the first heat conduction pipe and the second heat conduction pipe at the two ends through the heat dissipation plate, and then heat in the device shell is