Combined sensor

The utility model discloses a combined sensor, and relates to the technical field of chip packaging. Comprising a substrate, and a housing, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip and a pressure ASIC chip which are arranged on the substrate, and the substrate and the hou...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	SUN YANE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS
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Beschreibung
Zusammenfassung:	The utility model discloses a combined sensor, and relates to the technical field of chip packaging. Comprising a substrate, and a housing, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip and a pressure ASIC chip which are arranged on the substrate, and the substrate and the housing jointly define a first mounting cavity and a second mounting cavity; the pressure MEMS chip is positioned in the first mounting cavity; the microphone MEMS chip is located in the second installation cavity, the microphone MEMS chip divides the second installation cavity into a front cavity and a rear cavity, the rear cavity is communicated with the first installation cavity through the substrate channel, and the housing is provided with a sound hole communicated with the front cavity. According to the combined sensor, the volume of the rear cavity of the MEMS chip of the microphone is increased, the signal-to-noise ratio of the microphone is improved, and the overall performance of the combined sensor is impro