Microwave power amplifier tube packaging device
The utility model relates to the technical field of device packaging, in particular to a microwave power amplifier tube packaging device, which comprises a cavity comprising a bottom plate and a plurality of side plates, and the side plates are arranged on the bottom edge and are integrally formed w...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the technical field of device packaging, in particular to a microwave power amplifier tube packaging device, which comprises a cavity comprising a bottom plate and a plurality of side plates, and the side plates are arranged on the bottom edge and are integrally formed with the bottom plate; the printed board is welded on the bottom board; the power amplifier tube is welded on the printed board through a pin; the cover plate is welded to the top of the cavity, a sealed space is formed between the cover plate and the cavity, the sealed space is filled with nitrogen, the power amplifier tube is sealed and packaged through the cavity and the cover plate, when external air pressure changes, the internal air pressure cannot be affected, an internal chip cannot be ignited, and the safety of the device is improved.
本实用新型涉及器件封装技术领域,尤其涉及一种微波功放管封装装置,包括:腔体,包括:底板和多个侧板,多个侧板排布于底边边缘,且多个侧板于底板一体成型;印制板,焊接于底板上;功放管,通过引脚焊接于印制板;盖板,焊接于腔体顶部,与腔体之间形成密封空间,密封空间内填充有氮气,通过腔体与盖板对功放管进行密封封装,且密封空间内填充氮气,外界的气压发生变化时,不 |
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