Liquid cooling heat dissipation device

The utility model relates to a liquid cooling heat dissipation device, the liquid cooling heat dissipation device comprises a housing and a heat dissipation member, the housing is internally provided with a first flow channel area, a second flow channel area, a gap and a first flow guide cavity which are communicated with each other, and the first flow channel area is communicated with the second flow channel area through the gap; the first flow guide cavity extends from the liquid inlet to the first flow channel area, and the sectional area of the first flow guide cavity is gradually increased; the first flow channel area and/or the second flow channel area are/is further provided with at least one high heat dissipation area, and the multiple columnar heat dissipation piece arrays are arranged in the high heat dissipation areas. The utility model has the advantages that the plurality of columnar heat dissipation pieces can better dissipate heat generated by the high-power-consumption chip. After the cooling