Wafer packaging testing device

The utility model belongs to the technical field of wafer production, particularly relates to a wafer packaging testing device, and provides the following scheme aiming at the problem that a chip is cracked and damaged in the testing process due to the fact that the force of a testing probe is too large and no over-voltage protection mechanism exists when a pressure resistance test is carried out in the prior art. The device comprises a probe station, a glass shell, an air supply device, an air extractor and an exhaust port, the top of the glass shell is fixedly connected with the top of the probe station, the air supply device is fixedly connected to one side of the glass shell, the air extractor is fixedly connected to the top of the glass shell, and the exhaust port is fixedly connected to one corner of the top of the glass shell; the clamping assembly comprises a mounting plate which is connected to the top of the second fixing plate in a sliding manner; and the overvoltage protection assembly comprises a