Integrated thermal sensor and device

Integrated thermal sensors and devices are disclosed. An integrated thermal sensor having a housing defining an interior space. The support region extends through the interior space; a plurality of thermocouple elements are carried by the support region and electrically coupled to each other. Each thermocouple element is formed of first and second thermoelectrically active regions of first and second thermoelectrically active materials, respectively, the first thermoelectrically active material having a first Seebeck coefficient and the second thermoelectrically active material having a second Seebeck coefficient other than the first Seebeck coefficient. At least one of the first thermoelectrically active region and the second thermoelectrically active region is a silicon-based material. The first and second thermoelectrically active regions of each thermocouple element are formed by respective elongated regions extending from and transversely to the support region into the interior space of the housing at a