Packaging structure of semiconductor

The utility model relates to the technical field of packaging structures, and discloses a packaging structure of a semiconductor, which comprises a semiconductor chip and a pin connected with the semiconductor chip, and the pin is provided with a buffer disturbance member. And a heat dissipation shell is arranged on the semiconductor chip. According to the packaging structure of the semiconductor provided by the utility model, the buffering disturbance piece is arranged, so that the semiconductor chip can be buffered, the heat of the semiconductor chip can be dissipated, the heat dissipation effect can be improved, and the use safety can be improved. 本实用新型涉及封装结构技术领域，且公开了一种半导体的封装结构，包括半导体芯片以及与半导体芯片连接的引脚，所述引脚上设有缓冲扰动件；所述半导体芯片上设有散热壳。本实用新型提出一种半导体的封装结构，本实用新型通过设有缓冲扰动件，可对半导体芯片进行缓冲的同时，对半导体芯片进行散热，增加散热效果，增加使用的安全性。