Package structure

The utility model discloses a packaging structure. The packaging structure comprises a substrate; an optical integrated circuit stacked on the substrate and having a first through-hole for electrically connecting the substrate; an electrical integrated circuit stacked on the optical integrated circuit and electrically connected to the first through hole; and a chip stacked on the electrical integrated circuit and electrically connecting the substrate and the electrical integrated circuit. According to the technical scheme, at least the length of an electric path from the electric integrated circuit to the substrate can be shortened. 本申请公开了一种封装结构，该封装结构包括：基板；光集成电路，堆叠设置在基板上，并且具有用于电连接基板的第一贯通孔；电集成电路，堆叠设置在光集成电路上，并且电连接第一贯通孔；芯片，堆叠设置在电集成电路上，并且电连接基板与电集成电路。本申请的上述技术方案，至少能够缩短电集成电路到基板的电性路径长度。