Packaging substrate and LED packaging device

The embodiment of the utility model provides a packaging substrate and an LED packaging device. The packaging substrate comprises a substrate body, a first circuit layer arranged on the front face of the substrate body, and a second circuit layer arranged on the back face of the substrate body and electrically connected with the first circuit layer. The first dam layer is arranged on one side, deviating from the substrate main body, of the first circuit layer; the second dam layer is arranged on one side, deviating from the substrate main body, of the second circuit layer; an overflow groove is formed in the side, away from the base plate body, of the first box dam layer and used for containing redundant connecting materials. According to the packaging substrate, the overflow groove is formed in the first box dam layer, redundant connecting materials can be contained through the overflow groove, and therefore the sealing performance between the packaging substrate and the quartz glass is improved when the fir