Semiconductor chip
The utility model provides a semiconductor chip, comprising a substrate, a chip surface source electrode, an external source electrode pin and a bonding assembly, the chip surface source electrode and the external source electrode pin are respectively arranged at different positions on the substrate...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model provides a semiconductor chip, comprising a substrate, a chip surface source electrode, an external source electrode pin and a bonding assembly, the chip surface source electrode and the external source electrode pin are respectively arranged at different positions on the substrate, and the chip surface source electrode and the external source electrode pin are connected through the bonding assembly; the chip surface source electrode is provided with a first bonding area, the external source electrode pin is provided with a second bonding area, the bonding assembly comprises a conductive lead, the first end of the conductive lead is in bonding connection with the first bonding area through a plurality of first bonding structures, and the second end of the conductive lead is in bonding connection with the second bonding area through a second bonding structure. According to the semiconductor chip provided by the utility model, the bonding structure is added, the contact area between the conduc |
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