Pressing structure for chip packaging
The utility model discloses a lamination structure for chip packaging, which comprises a packaging installation assembly. Comprising a first packaging installation frame, a second packaging installation frame making contact with the first packaging installation frame, a cylinder arranged on the oute...
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| creator | TAN AIJUN LIU BING DONG FENGZHI SHANG JIANGUO LIU YUEZU |
| description | The utility model discloses a lamination structure for chip packaging, which comprises a packaging installation assembly. Comprising a first packaging installation frame, a second packaging installation frame making contact with the first packaging installation frame, a cylinder arranged on the outer side of the first packaging installation frame, a supporting rod connecting the first packaging installation frame with the cylinder and a protection frame penetrating through the cylinder. The protection reset assembly comprises an annular baffle fixed to the surface of the cylinder, a spring connected to the bottom face of the annular baffle, a round hole formed in the middle of the protection frame and a blocking piece fixed to the bottom face of the cylinder. And packaging the assembly. According to the utility model, through the mutual cooperation of the packaging installation structure, the protection reset structure and the packaging structure, the chip is directly pressed, protected and isolated when the |
| format | Patent |
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Comprising a first packaging installation frame, a second packaging installation frame making contact with the first packaging installation frame, a cylinder arranged on the outer side of the first packaging installation frame, a supporting rod connecting the first packaging installation frame with the cylinder and a protection frame penetrating through the cylinder. The protection reset assembly comprises an annular baffle fixed to the surface of the cylinder, a spring connected to the bottom face of the annular baffle, a round hole formed in the middle of the protection frame and a blocking piece fixed to the bottom face of the cylinder. And packaging the assembly. 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Comprising a first packaging installation frame, a second packaging installation frame making contact with the first packaging installation frame, a cylinder arranged on the outer side of the first packaging installation frame, a supporting rod connecting the first packaging installation frame with the cylinder and a protection frame penetrating through the cylinder. The protection reset assembly comprises an annular baffle fixed to the surface of the cylinder, a spring connected to the bottom face of the annular baffle, a round hole formed in the middle of the protection frame and a blocking piece fixed to the bottom face of the cylinder. And packaging the assembly. According to the utility model, through the mutual cooperation of the packaging installation structure, the protection reset structure and the packaging structure, the chip is directly pressed, protected and isolated when the</description><subject>CONVEYING</subject><subject>HANDLING THIN OR FILAMENTARY MATERIAL</subject><subject>MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS</subject><subject>PACKING</subject><subject>PERFORMING OPERATIONS</subject><subject>STORING</subject><subject>TRANSPORTING</subject><subject>UNPACKING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFANKEotLs7MS1coLikqTS4pLUpVSMsvUkjOyCxQKEhMzk5MB0ryMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjUYqC61LzUknhnPyNDSyNjc1NLg9BQY6IUAQCtnig4</recordid><startdate>20230623</startdate><enddate>20230623</enddate><creator>TAN AIJUN</creator><creator>LIU BING</creator><creator>DONG FENGZHI</creator><creator>SHANG JIANGUO</creator><creator>LIU YUEZU</creator><scope>EVB</scope></search><sort><creationdate>20230623</creationdate><title>Pressing structure for chip packaging</title><author>TAN AIJUN ; LIU BING ; DONG FENGZHI ; SHANG JIANGUO ; LIU YUEZU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN219237590UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CONVEYING</topic><topic>HANDLING THIN OR FILAMENTARY MATERIAL</topic><topic>MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS</topic><topic>PACKING</topic><topic>PERFORMING OPERATIONS</topic><topic>STORING</topic><topic>TRANSPORTING</topic><topic>UNPACKING</topic><toplevel>online_resources</toplevel><creatorcontrib>TAN AIJUN</creatorcontrib><creatorcontrib>LIU BING</creatorcontrib><creatorcontrib>DONG FENGZHI</creatorcontrib><creatorcontrib>SHANG JIANGUO</creatorcontrib><creatorcontrib>LIU YUEZU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAN AIJUN</au><au>LIU BING</au><au>DONG FENGZHI</au><au>SHANG JIANGUO</au><au>LIU YUEZU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Pressing structure for chip packaging</title><date>2023-06-23</date><risdate>2023</risdate><abstract>The utility model discloses a lamination structure for chip packaging, which comprises a packaging installation assembly. Comprising a first packaging installation frame, a second packaging installation frame making contact with the first packaging installation frame, a cylinder arranged on the outer side of the first packaging installation frame, a supporting rod connecting the first packaging installation frame with the cylinder and a protection frame penetrating through the cylinder. The protection reset assembly comprises an annular baffle fixed to the surface of the cylinder, a spring connected to the bottom face of the annular baffle, a round hole formed in the middle of the protection frame and a blocking piece fixed to the bottom face of the cylinder. And packaging the assembly. According to the utility model, through the mutual cooperation of the packaging installation structure, the protection reset structure and the packaging structure, the chip is directly pressed, protected and isolated when the</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS PACKING PERFORMING OPERATIONS STORING TRANSPORTING UNPACKING |
| title | Pressing structure for chip packaging |
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