Pressing structure for chip packaging

The utility model discloses a lamination structure for chip packaging, which comprises a packaging installation assembly. Comprising a first packaging installation frame, a second packaging installation frame making contact with the first packaging installation frame, a cylinder arranged on the outer side of the first packaging installation frame, a supporting rod connecting the first packaging installation frame with the cylinder and a protection frame penetrating through the cylinder. The protection reset assembly comprises an annular baffle fixed to the surface of the cylinder, a spring connected to the bottom face of the annular baffle, a round hole formed in the middle of the protection frame and a blocking piece fixed to the bottom face of the cylinder. And packaging the assembly. According to the utility model, through the mutual cooperation of the packaging installation structure, the protection reset structure and the packaging structure, the chip is directly pressed, protected and isolated when the