Thermal forming die
The utility model discloses a thermal forming die. The thermal forming mold comprises an upper mold base, a lower mold base and a plurality of heat conduction pipes, an upper forming face is formed below the upper mold base, a plurality of upper heat storage channels are formed in the upper mold bas...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model discloses a thermal forming die. The thermal forming mold comprises an upper mold base, a lower mold base and a plurality of heat conduction pipes, an upper forming face is formed below the upper mold base, a plurality of upper heat storage channels are formed in the upper mold base, the upper heat storage channels are arranged in the upper mold base at intervals, and the heat conduction pipes are arranged in the lower mold base. The plane where the upper heat storage channels are located is parallel to the upper forming face. A lower forming face is formed above the lower die base, a plurality of lower heat storage channels are formed in the lower die base, the lower heat storage channels are arranged in the lower die base at intervals, and the plane where the lower heat storage channels are located is parallel to the lower forming face. One end of each heat conduction pipe is communicated with a high-temperature medium generator, the other ends of part of the heat conduction pipes are comm |
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