Core board and circuit board structure

The utility model relates to a core board and a circuit board structure, the core board comprises a warp yarn layer and a weft yarn layer, the warp yarn layer and the weft yarn layer are tiled and laminated to form a base part, the weft yarn layer is located below the warp yarn layer, the base part is covered with resin to form a prepreg, and the upper surface and the lower surface of the prepreg are respectively provided with a copper foil layer. The warp yarn layer and the weft yarn layer are flatly laid and stacked to form the base part, the weft yarn layer is located below the warp yarn layer, the glass fiber effect is eliminated, then the base part is covered with the resin to form the prepreg, the copper foil layer is arranged, the core plate is obtained, the design difficulty and the machining difficulty are reduced, and material cost waste caused by rotary plate production is reduced. 本实用新型涉及一种芯板及电路板结构，所述芯板，包括：经纱层和纬纱层，所述经纱层和纬纱层平铺层叠形成基部，所述纬纱层位于所述经纱层的下方，所述基部覆盖树脂以形成半固化片，所述半固化片的上表面和下表面均设有铜箔层。本实用新型通过经纱层和纬纱