Planar optocoupler packaging structure

The utility model relates to the technical field of semiconductor power devices, and provides a planar optocoupler packaging structure, which comprises a first support, a second support, a light-emitting chip, a light-receiving chip and a first packaging layer. A first groove and a second groove are formed in the positions, close to each other, of the first support and the second support, the light-emitting chip is arranged in the first groove, the light-receiving chip is arranged in the second groove, the first packaging layer wraps the light-emitting chip, the light-receiving chip, the first groove and the second groove, the first support penetrates through the first packaging layer and extends outwards to form a first pin, and the second support penetrates through the second packaging layer and extends outwards to form a second pin. The second support penetrates through the first packaging layer and extends outwards to form a second pin. Therefore, the optocoupler packaging structure with the chip arranged